The quantity of electricity (96,500 coulombs) which will deposit one electrochemical equivalent metal in grams.
The amount of chemical change or metal deposition produced by an electric current. It is proportional to the total quantity of electricity.
FEDERAL COORDINATING COUNCIL FOR SCIENCE ENGINEERING AND TECHNOLOGY
FOOD AND DRUG ADMINISTRATION
A system for communicating information about the performance processes
products or services. Feedback loops essential for continuos improvement.
FEDERAL EMERGENCY MANAGEMENT AGENCY
FRONT END PROCESSORS
FEDERATION OF ENVIRONMENTAL TECHNOLOGISTS
FEDERAL HAZARDOUS SUBSTANCES ACT
FORGING INDUSTRY ASSOCIATION
FOCUSED ION BEAM
FLAME IONIZATION DETECTION
Usually a hot ( greater than 150F ) agitated clear deionized water at the end of a
plating line just before the drying station.
FEDERAL IMPLEMENTATION PLANS
FIRE GILDING (GOLD AMALGAM)
The process of applying mercury and gold amalgam to the part. The part is then heated to evaporate the mercury and
burnished to a high luster. This technique is banned in most countries because of the potential of mercury poisoning.
FIELD INVESTIGATION TEAM
Thin layer of nickel or copper put on a clean activated base metal in order to
seal minor blemishes in same; precedes the PLATING process.
A pictorial representation of a process indicating the main steps, branches, decision points and the eventual outcome of the process.
FAILURE MODE AND EFFECT ANAYLSIS is a technique for systematically reviewing
the ways in which a process, product, or service can fail and impact such failures could
have on customers, employees, or other processes. Using this analysis, quality engineers can
predict field-failure rates, design recovery systems, and estimate the need for additional parts or personnel.
This equation is used to calculate the absorption rate in a solid or activated carbon.
FIBERGLASS REINFORCED PLASTIC
FEDERATION OF SOCIETIES FOR COATING TECHNOLOGY
FEASIBILITY STUDY GUIDANCE DOCUMENT
FREE TRADE AGREEMENT
FEDERAL TRADE COMMISSION
FIXED TREATMENT UNITS
A process of producing printed circuit boards entirely by chemical deposition. It doesnt need any electro-deposition processes