Guest Editorial -For Plateworld.com                                                 

 Don Baudrand, Don Baudrand Consulting,   e-mail:donwb@tscnet.com

 

Acid Copper Plating Solution For Printed Circuits

High throwing power

Operating Instructions

Solution Composition

Optimum

Range

Copper sulfate .5 H2O 80 g/l 60-100 g/L
Sulfuric acid (concentrated) 225 g/L 180-270 g/L
Chloride (HCl) 50 mg/L 50-80 mg/L
Additive A 0.5% by vol. 0.4-0.6% by vol.
Additive B 0.1% by vol. 0.1-0.2% by vol.
Additive C 0.1% by vol. 0.1-0.2% by vol.

 

Operating Conditions

Optimum

Range

Temperature 25C 25-30C
Current Density 3 amp/sqdm -10 amp/sqdm

Agitation clean air from a low-pressure oil-less blower

Equipment

Anodes Phosphorized copper 0.4-0.6% phosphorus (0.6%P preferred)

Anode bags Acid resistant polypropylene

Tanks Acid resistant rubber lined or polypropylene

Plating Solution make up procedure

  1. Add water to a storage tank to the final volume of the plating solution. Agitate the water using air or mechanical stirring.
  2. Add Sulfuric acid CAUTION: ADD VERY SLOWLY. WEAR A FACE SHIELD RUBBER APRON, RUBBER BOOTS AND RUBBER GLOVES. SULFURIC ACID CAUSES SEVER BURNS IN CONTACT WITH SKIN OR EYES. IF CONTACT TAKES PLACE THOROUGHLY FLUSH WITH CLEAN WATER. SEEK IMMEDIATE MEDICAL ATTENTION.
  3. While mixing add copper sulfate pentahydrate.
  4. After dissolving the entire copper sulfate, Carbon treat the solution as follows. Using 13.6 g/L activated carbon. Mix thoroughly 1-2 hours. Turn off agitation and allow carbon to settle about 1-4 hours and the temperature to cool. Filter the treated solution into the plating tank. Be sure no carbon enters the plating tank.
  5. Add water to near the final volume.
  6. Place the anodes and make all connections. Purify the solution by electrolyzing using a corrugated steel cathode at 0.5 8 amps/sq. dm for 1-2 hours
  7. Add the additive B and then Additive A.
  8. Add the additive C. Mix well.
  9. The plating solution is now ready to electroplate copper.

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