DONALD (DON) BAUDRAND, CEF
Extensive experience in research and development and hands on plating of electroless nickel plating processes and products. Pioneered Electroless nickel plating on thin-film memory discs. Knowledge and experience in all aspects of preparation and plating, metallized ceramics, printed circuits, hardware, automotive, electroless forming and electronics. Experience in electroless copper, gold and palladium. Formulating electroless nickel phosphorus and alloys, nickel boron and alloys of various metals and including nano-particulate materials. Familiar with equipment, process design, formulation, maintenance and troubleshooting electroless and electroplating solutions, chromate and non chrome conversion coatings.
ELECTRODEPOSITION; ELECTROPLATING; ELECTROLYSIS.
Knowledgeable of a whole range of electroplating materials and processes, having written numerous papers and several Books. Worked with plating of gold, silver, cobalt, nickel (including sulfamate nickel, nickel sulfate (Watts) Woods and Sulfamate nickel strikes, bright, leveling nickel and special nickel processes. Familiar with Copper plating from cyanide, acid and pyrophosphate solutions, along with sulfonic, sulfuric and fluoboric acid processes for copper, tin lead, and alloys of various metals. Experience in cadmium, zinc, brass and bronze plating. Can answer questions on cleaning, activating and surface preparation and conditioning processes.
Knowledgeable in the preparatory steps, including cleaning, etching, conditioning and sensitizing and catalysts, for electroless plating of nickel and copper on plastic substrates and electroplating of plastics. Co-authored a book on plating of ABS plastic.
PRINTED-WIRING (Circuit) BOARD PROCESSES.
Experience includes preparation for and plating of printed-wiring boards, including through hole and surface mount boards as well as flex, multi layer and molded circuits. Designed processes and equipment for the manufacture of printed circuit boards of all types. Analyzed process and plating chemicals for maintenance of the solutions. Did research and supervised research and development of process chemicals and plating solutions for printed circuits, including multi-layered bonding chemicals. As a consultant, advised printed circuit manufacturers as to type of preparation chemicals, plating chemicals, equipment and process sequence design. Wrote chapter 9 of Electronic Materials and Processes Handbook Published by McGraw Hill.
Experienced in the use of process cycles and chemistry for direct plating of through-hole printed circuits, including both theory and practice of direct electroplating
MCM-C and MCM-L (MULTICHP MODULES).
Experience in processes for plating MCM's, including patents in this field.
CLEANING OF MATERIALS FOR PLATING.
Experience Including formulation, cleaning of leaded alloys, steel alloys, copper alloys, acid, alkaline and solvent processes.
ELECTROGALVANIZING AND OTHER CONTINUOUS STRIP STEEL PLATING.
Involvement in continuous plating as practiced in steel mills for zinc, nickel, copper brass and bronze.
ADVANCED TECHNOLOGY IN THE USE OF ELECTRO-LESS NICKEL FOR ELECTRONICS AND PRINTED CIRCUITS
New uses for specialty electro-less nickel processes are discussed, these uses include plating of printed circuit boards to allow direct mounting of components such as inc. Chips, plating of ceramic circuits, and through hole and overall plating of printed circuit boards. Download our complete document here
AUTOCATALYTIC ALLOY PLATING PROCESSES
Electroless (autocatalytic) plating processes can greatly increase the storage capacity of memory discs used in Winchester-type disk drives. A non¬magnetic electroless nickel layer is deposited onto a carefully prepared aluminum substrate, polished to a near perfect finish, activated, and plated with an electroless cobalt-phosphorus alloy. Download our complete document here
ELECTROLESS NICKEL AND COBALT FOR MEMORY DISCS
Computers use different types of memory discs to store information. Today's surface technologies for producing these discs will be discussed with emphasis on thin film memory discs. Download our complete document here
PLATING OF ABS PLASTIC
There are several grades of ABS plastics. But only one platable grade (In the early days it was Cycolac EP 3510) There are now a number of suppliers of plating grade ABS. I do not know the new designations. Therefore if you specify Platable grade of ABS you are likely to get the correct product. Download our complete document here
Conditions and Reliability download document: click here
History of Electroplating download document: click here
Nickel reduce gold download document: click here
Soldering Electroless nickel download document: click here
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Ceramic Microelectric Circuits download document: click here
Hot Alkaline Cleaners download document: click here
Questions From Troubleshoot Webinar download document: click here
Sulfamate Nickel Plating download document: click here
Deposit Characteristics of Nickel download document: click here
Plating onto Magnesium Alloys download document: click here
Advancements in electroless download document: click here
Role of electroless nickel plating download document: click here
Soldering, brazingdie and wire bond download document: click here
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Gold plating from sulfite solutions
Pink Gold as gold sulfite 1.25 to 2 gms/L Sulfite salt 90 gm/L Nickel 0.5 g/L as a chelate Copper as a chelate Brightener arsenate 20 ppm