DONALD (DON) BAUDRAND, CEF Consultant ELECTROLESS PLATING. Extensive experience in research and development and hands on plating of electroless nickel plating processes and products. Pioneered Electroless nickel plating on thin-film memory discs. Knowledge and experience in all aspects of preparation and plating, metallized ceramics, printed circuits, hardware, automotive, electroless forming and electronics. Experience in electroless copper, gold and palladium. Formulating electroless nickel phosphorus and alloys, nickel boron and alloys of various metals and including nano-particulate materials. Familiar with equipment, process design, formulation, maintenance and troubleshooting electroless and electroplating solutions, chromate and non chrome conversion coatings. ELECTRODEPOSITION; ELECTROPLATING; ELECTROLYSIS. Knowledgeable of a whole range of electroplating materials and processes, having written numerous papers and several Books. Worked with plating of gold, silver, cobalt, nickel (including sulfamate nickel, nickel sulfate (Watts) Woods and Sulfamate nickel strikes, bright, leveling nickel and special nickel processes. Familiar with Copper plating from cyanide, acid and pyrophosphate solutions, along with sulfonic, sulfuric and fluoboric acid processes for copper, tin lead, and alloys of various metals. Experience in cadmium, zinc, brass and bronze plating. Can answer questions on cleaning, activating and surface preparation and conditioning processes. PLASTICS PLATING. Knowledgeable in the preparatory steps, including cleaning, etching, conditioning and sensitizing and catalysts, for electroless plating of nickel and copper on plastic substrates and electroplating of plastics. Co-authored a book on plating of ABS plastic. PRINTED-WIRING (Circuit) BOARD PROCESSES. Experience includes preparation for and plating of printed-wiring boards, including through hole and surface mount boards as well as flex, multi layer and molded circuits. Designed processes and equipment for the manufacture of printed circuit boards of all types. Analyzed process and plating chemicals for maintenance of the solutions. Did research and supervised research and development of process chemicals and plating solutions for printed circuits, including multi-layered bonding chemicals. As a consultant, advised printed circuit manufacturers as to type of preparation chemicals, plating chemicals, equipment and process sequence design. Wrote chapter 9 of Electronic Materials and Processes Handbook Published by McGraw Hill. DIRECT ELECTROPLATING. Experienced in the use of process cycles and chemistry for direct plating of through-hole printed circuits, including both theory and practice of direct electroplating MCM-C and MCM-L (MULTICHP MODULES). Experience in processes for plating MCM's, including patents in this field. CLEANING OF MATERIALS FOR PLATING. Experience Including formulation, cleaning of leaded alloys, steel alloys, copper alloys, acid, alkaline and solvent processes. ELECTROGALVANIZING AND OTHER CONTINUOUS STRIP STEEL PLATING. Involvement in continuous plating as practiced in steel mills for zinc, nickel, copper brass and bronze. 621 NE Harrison Street,  Poulsbo, WA 98370 Phone: 360-598-2250   e-mail: donwb@tscnet.com